In microelectronics assembly, there’s no room for error. That’s why we built our global microelectronics capabilities around cutting-edge production tools and highly experienced teams—allowing us to provide reliable, high-tech manufacturing and engineering solutions for the most highly regulated markets.
Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, next-gen communications, and advanced computing.
Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.
When a leading provider of high-resolution, low-cost lidar sensors was ready to scale, they turned to Benchmark.
Benchmark improved yields on complex microelectronics and SMT assembly for aerospace and defense application.
Benchmark helped our partner manufacture a groundbreaking miniaturized design.